THE CHEMISTRYResin
systems
Lignin-based thermoset chemistry for the insulating layers of printed circuit boards.
Explore resin systemsPCB MATERIALSThe layers beneath
The layers beneath
printed circuit boards.
Resin chemistry, reinforcement and composite formats. One connected development program.
A CONNECTED MATERIAL PLATFORMDifferent roles.
Different roles.
One material system.
Explore the resin, prepreg and core formats at the center of Lignity’s PCB development program.
MATRIX CHEMISTRY
The chemistry that brings the system together.
The resin matrix binds the reinforcement and contributes to the composite’s electrical, thermal and mechanical behavior.
Explore resin systemsCopperPrepregCore
Illustrative PCB stack-up
THREE MATERIAL FORMATSA practical route
A practical route
to industrial evaluation.
Explore the intended role of each format and the questions that guide its development.
THE CHEMISTRYResin
THE INTERFACEPrepregs
Bringing resin and bio-based reinforcement together in a partially cured material format.
Explore prepregs
THE STRUCTURELaminate
cores
Fully cured structural material formats for the foundation of a printed circuit board.
Explore laminate coresMATERIAL REFERENCEThree formats.
Three formats.
One connected system.
The chemistry, structure and role of each format within the PCB material platform.
Resin systems
| Material direction | Lignin-based thermoset resin systems |
|---|---|
| Material role | Matrix chemistry for reinforced PCB substrates |
| Material focus | Formulation, curing and composite interaction |
| Engineering focus | Electrical insulation, thermal response, moisture behavior and processing |
Prepregs
| Material direction | Lignin-based resin with bio-based reinforcement |
|---|---|
| Material format | Partially cured reinforced composite |
| Curing state | B-stage |
| Engineering focus | Impregnation, handling, resin flow, cure control and interlayer interaction |
Laminate cores
| Material direction | Lignin-based reinforced laminate systems |
|---|---|
| Material format | Fully cured structural PCB laminate |
| Curing state | C-stage |
| Engineering focus | Dimensional stability, copper adhesion, electrical behavior and thermal response |
QUESTIONS ABOUT THE PLATFORM
Start with a clear understanding.
Which PCB material formats does Lignity focus on?
Lignity’s platform connects lignin-based resin systems, B-stage prepregs and C-stage laminate cores. Each format has a distinct role in the PCB stack-up.
How does the material approach relate to PCB manufacturing?
The program addresses familiar PCB formats and manufacturing considerations, including impregnation, lamination, copper adhesion and downstream processing.
How can we discuss an application or trial?
Contact Lignity with your application, material format and relevant process requirements. Together we can define the scope, samples and schedule for a focused collaboration.
WORK WITH LIGNITYBuild the next
Build the next
material foundation.
An application. A material question. A shared next step. Let’s start a conversation.
Discuss a partnership