PCB MATERIALS / THE INTERFACE

Prepregs.

Bringing resin and bio-based reinforcement together in a partially cured material format.

B-STAGE / PARTIALLY CURED

A defined role
in the material system.

Prepreg is a resin-impregnated reinforcement in a partially cured, or B-stage, state. It is used during lamination to build the insulating layers between conductive structures.

This format is part of Lignity’s connected resin and reinforcement programme, bringing material chemistry and PCB architecture into focus.

View the material reference
THE DEVELOPMENT QUESTION

How can the resin and reinforcement be combined with consistent handling, flow and curing behaviour during lamination?

WHERE PARTNERS CAN CONTRIBUTE

Reinforcement architecture, impregnation and handling requirements, lamination windows and the intended stack-up.

Begin with a target application and an appropriate reference material. Together, these help define the tests and processing conditions needed for a useful assessment.

See the evaluation pathway
WORK WITH LIGNITY

Let’s define
the next material question.

An application. A material question. A shared next step. Let’s start a conversation.

Discuss a partnership